NMOS CMOS Package Temperature Remarks
Z80
2.5 MHz 		Z80A
4 MHz 		Z80B
6 MHz 		Z80H
8 MHz 		2.5 MHz 4 MHz 6 MHz 8 MHz 10 MHz 20 MHz
Zilog new Z0840004 Z0840006 Z0840008 Z84C0004 Z84C0006 Z84C0008 Z84C0010 Z84C0020 P: plastic DIP
A: LQFP (short legs, thinner QFP) (C)
F: QFP (C)
V: PLCC
C: ceramic DIP (brazed pins)
D: ceramic DIP (frit seal) 		S: 0~70 °C
E: -40~100 °C *
M(B): -55~125 °C 		-C/E: not RoHS compliant
-G: RoHS compliant (Pb free)
6 MHz versions rated for 6.17 MHz
early specimens can be marked as "Z-80A CPU", "Z80A-CPU" etc
Z8300 (Z80L) is a low power, low speed Z80 (plastic DIP only)
Z8300-1: 1 MHz, -3: 2.5 MHz. Unclear if NMOS or CMOS
* -40~85 °C for old style NMOS
old Z8400 Z8400A Z8400B
NEC µPD780 µPD780-1 µPD780-2 µPD70008A-4
µPD70008 		µPD70008A-6
µPD70008A 		µPD70008A-8 (at end, or before "-" in part #)
C: plastic DIP
G: QFP (C)
L: PLCC (C)
D: ceramic DIP (brazed pins) 		µPD70008A:
    -45~85 °C
others:
    0~70 °C 		markings don't show the "µP.." from part #
Sharp LH0080 LH0080A LH0080B LH0080E LH5080 LH5080A <none> plastic DIP
M: QFP
U: PLCC 		0~70 °C
QFP: 0~60 °C
-H: -20~85 °C 		-L: HALT power save function (C)
SGS
(ST) 		Z8400 Z8400A Z8400B Z8400H Z84C00A Z84C00B Z84C00H B: plastic DIP
C: PLCC
D: ceramic DIP (brazed pins)
F: ceramic DIP (frit seal) 		1: 0~70 °C
6: -40~85 °C
2: -55~125 °C 		ST (SGS-Thomson):
  new company name after 1987 merger with Thomson
  but same part # identification
  differences are in mfr. logos & date codes
Mostek MK3880
MK3880-10
MK3880-20 		MK3880-4 MK3880-6 N: plastic DIP
P: ceramic DIP (brazed pins)
J: ceramic DIP (frit seal) 		MKI3880 & -10/-14:
    -40~85 °C
MKB3880 and -20:
    -55~125 °C
-34: -55~100 °C
others: 0~70 °C 		MKB3880: military spec (ceramic DIP only)
MKI3880: industrial spec (ceramic DIP only)
-..0: 2.5 MHz, -..4: 4 MHz version
Toshiba TMPZ84C00-3 TMPZ84C00A
TMPZ84C00 		TMPZ84C00A-6 TMPZ84C00A-8 (at end, or before "-" in part #)
P: plastic DIP
T: PLCC
M: SOP (0.8mm pitch, 12mm wide)
F: QFP * 		-40~85 °C * same pitch, but dimensions differ from other mfr's QFPs!
GoldStar Z8400 Z8400A Z8400B P: plastic DIP
D: ceramic DIP (frit seal) 		??? no datasheets to be found
ROHM BU18400 * BU18400A BU18400B BU18400H * BU184C00 * plastic DIP 0~70 °C * from datasheet, no (photos of) actual specimens
East German
clone 		U880D
UB880D
80-CPU
VB880D 		UA880D
80A-CPU 		U880DC08
Thesys Z80H
80H-CPU 		U84C00DC02 * U84C00DC04 * plastic DIP VB880D:
    -25~85 °C
others:
    0~70 °C 		minor differences in flag behavior
some parts with 2.5mm pitch (vs 2.54mm)
80..-CPU: export versions
* only very few produced
Romanian clone MMN80CPU plastic DIP
ceramic DIP (brazed pins) 		??? specced for 2.5~3.5 MHz
Russian clone KR1858VM1
(KP1858VM1)
KM1858VM1
T34BM1 		KR1858VM1:
    plastic DIP
KM1858VM1:
    ceramic DIP (brazed pins)
T34BM1:
    mostly ceramic DIP 		??? copy of East German clone
Power
consumption
(mA) 		typ ? 90 ? ? 8 10 15 20 25 50
max 150 200 15 20 30 40 50 100

(C) Only CMOS parts

Notes